Posts Tagged ‘Pack Expo’



Connected at PACK EXPO 2016

Bosch at PACK EXPO

At the 60th-anniversary PACK EXPO International at McCormick Place, Chicago, Bosch debuted the HMI 4.0, the human machine interface (HMI) of the next generation, which is the optimal gateway for industry 4.0. It enables a uniform and intuitive machine operation for both stand-alone machines as well as entire lines.

 

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