Exhibitions

interpack 2017 – a full success

The trade show interpack 2017 was a tremendous success for Bosch Packaging Technology. On more than 3,500 square meters booth space we presented new developments from our comprehensive portfolio for the food and pharma industries and registered a new record number of international trade visitors and decision-makers. …more




Keeping it clean with powders

Sigpack VPF – a revolutionary concept for powder filling
Bosch introduces the first freely scalable flat pouch machine to the market at interpack 2017 (hall 6, booth C30). Thanks to the modularization of the dosing and cross-sealing units, the Sigpack VPF is freely scalable from two to up to twelve lanes. In addition, pouch sizes are easily adjustable. The new decentralized stock of product makes it possible to package different products, such as salt and pepper, at the same time on one machine. …more


Packaging Services completes Bosch’s system competence

Customized services for all maintenance strategies
A comprehensive range of services to improve machine efficiency and productivity completes Bosch’s system and line competence. The focus at interpack 2017 is on solutions for preventive maintenance as well as services to eliminate unwanted machine conditions as quickly as possible. …more


Industry 4.0 live at Interpack

People, machines, processes, superordinate IT – everything and everyone is connected in the factory of the future. But which specific advantages does Industry 4.0 offer for process and packaging technology? At interpack 2017, visitors to Bosch’s booth can experience live, how higher production transparency increases productivity, quality and efficiency in day-to-day work. …more


Raise the bar

Whether chocolate, cereal or protein – consumers are increasingly asking for more individual bar products. In order to live up to manufacturers’ growing demands for maximum productivity, flexibility and quality, Bosch is unveiling its seamlessly integrated bar production system at interpack 2017. …more



Connected at PACK EXPO 2016

Bosch at PACK EXPO

At the 60th-anniversary PACK EXPO International at McCormick Place, Chicago, Bosch debuted the HMI 4.0, the human machine interface (HMI) of the next generation, which is the optimal gateway for industry 4.0. It enables a uniform and intuitive machine operation for both stand-alone machines as well as entire lines.

 

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