Events in asia




On the path to the connected factory

Professors from well-known Swiss and German universities visited Bosch Packaging Systems in Beringen, Switzerland, to discuss connectivity solutions for the packaging industry. In small groups, academics and engineers had the chance to exchange their views on Industry 4.0 topics. …more




interpack 2017 – a full success

The trade show interpack 2017 was a tremendous success for Bosch Packaging Technology. On more than 3,500 square meters booth space we presented new developments from our comprehensive portfolio for the food and pharma industries and registered a new record number of international trade visitors and decision-makers. …more




Keeping it clean with powders

Sigpack VPF – a revolutionary concept for powder filling
Bosch introduces the first freely scalable flat pouch machine to the market at interpack 2017 (hall 6, booth C30). Thanks to the modularization of the dosing and cross-sealing units, the Sigpack VPF is freely scalable from two to up to twelve lanes. In addition, pouch sizes are easily adjustable. The new decentralized stock of product makes it possible to package different products, such as salt and pepper, at the same time on one machine. …more


Page 1 of 212
Top of page